Lateral shift measurement using an optical technique

ABSTRACT

Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements include at least two measurements with different polarization states of incident light, each measurement including illuminating the measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between the diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

This is a continuation of application Ser. No. 11/271,773 filed Nov. 14,2005, now allowed and about to issue as U.S. Pat. No. 7,122,817, itselfa continuation of grandparent application Ser. No. 10/257,544 filed Feb.6, 2003, now U.S. Pat. No. 6,974,962.

FIELD OF THE INVENTION

This invention is generally in the field of manufacturing of multi-layerstructures, such as semiconductor wafers and integrated circuits, andrelates to an optical measuring method and system for control of layersalignment.

BACKGROUND OF THE INVENTION

Integrated circuits are multi-layer structures produced by applying asequence of deposition-lithography-etching steps to a semiconductorwafer. In such structures layers have to be precisely aligned with eachother, which is controlled by the so-called “overlay measurement”. Thismeasurement is usually accomplished using a box-within-a-box techniqueconsisting of the following. A rectangular frame-like structure isformed in a test site of each layer, and two adjacent layers areconsidered as being correctly aligned if a specific alignment betweenthe frames on these layers is provided. Overlay defining the alignmentis measured by comparing the shifts between the frames at oppositesides: determining whether the frames are precisely concentric, thesmaller frame being inside the larger one (in projection).

The above technique is carried out by an ordinary optical microscope,which is capable of measuring line width with a resolution limited byresolution of optical imaging systems, usually not less than severalnanometers. The current high-performance semiconductor devices, however,have features' dimensions of 0.13 μm and less, and require measurementsof overlay registration with the resolution of less than 1 nm.

A different alignment technique is disclosed in the U.S. Pat. No.5,216,257. According to this technique, two grating structures ofdifferent periodicity are deposited on two adjacent layers in amulti-layer structure, and a change in a moire fringe pattern caused bythe superposition of two gratings is detected, being indicative of agrating alignment error.

SUMMARY OF THE INVENTION

There is a need in the art to facilitate overlay measurements for thepurpose of correct alignment of layers in a multi-layer sample (e.g.,integrated circuit), by providing a novel optical method and system.

The main idea of the present invention is based on the fact that thediffraction of incident radiation from a pair gratings (or any otherdiffractive structures), located one on top of the other is affected byall geometrical aspects of the gratings, namely, both the parameters ofeach separate grating and their location relative to each other (i.e.,lateral shift). According to the present invention, the lateral shiftbetween two layers is determined by analyzing electromagnetic radiation(light) diffracted from gratings (patterned structure) of substantiallythe same periodicity, which are specifically arranged within a siteformed by regions of two layers. To this end, scatterometry (measuringdiffraction efficiency as a function of wavelength and/or angle ofincidence) or ellipsometry (measuring both change of polarizationamplitude and phase of the diffracted light) can be utilized. Thesetechniques are based on the detection of the so-called “diffractionsignature” of two gratings one on top of the other.

Thus, according to the invention, an effect of radiation diffractionfrom two patterned structures (gratings) of known periodicity locatedone on top of the other, caused by a lateral shift between the twopatterned structures, is detected and analyzed to determine an alignmenterror. The patterned structures are located within a site formed by tworegions of two layers, respectively. Preferably, two patternedstructures (gratings) of substantially the same periodicity are used.

According to different embodiments of the invention, the followingmethods are used: a so-called “direct method”, a method based onreference sites, and a method based on simple calibration. The directmethod is based on the initial calculations of a diffraction signatureusing certain well-defined models. The reference sites method is basedon the comparison between diffraction signatures measured in differentsub-regions of the site. The simple calibration based method utilizescertain reference data previously obtained by any suitable tool to beindicative of various diffraction signatures corresponding to respectivelateral shifts. These different methods require different sites preparedon the layers of a multi-layer sample.

The term “site” used herein signifies a location in a multi-layer samplethat includes two regions one on top of the other. Such a site may be atest site located outside the features containing area if a sample.

If layers' shift along more than one axis in the sample plane is to bedetermined, the test site (generally, grating containing site) includestwo main regions, one containing a grating structure aligned along theX-axis of the sample and the other along the Y-axis of the sample. Eachregion may contain several different sub-regions having differentnominal shifts between the gratings. The term “nominal” signifies ashift of the masks used for layer manufacturing, assuming perfect masksproduction and zero alignment error.

Another embodiment of the test structure may contain a two-dimensionalgrating enabling the measurement of the X and the Y components of thelateral shift at the same site. In order to avoid the possibility toconfuse between the X and the Y components several methods may be used:(a) Produce a test site whose period in the Y-axis is significantlydifferent than the period in the X-axis (b) measure the same siteseveral times using different polarizations (in case of polarizedreflectometry) (c) measure the same site from different directions. Allthe above methods result in different changes to the diffractionsignatures due to shifts in different directions, thus avoidingconfusion.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to understand the invention and to see how it may be carriedout in practice, a preferred embodiment will now be described, by way ofnon-limiting example only, with reference to the accompanying drawings,in which:

FIG. 1 is a schematic illustration of a cross-section of a site in asemiconductor wafer;

FIGS. 2A and 2B illustrate the principles of a direct method accordingto the invention;

FIG. 3 illustrates the principles of a reference sites based methodaccording to the present invention;

FIGS. 4-6 illustrate different simulation results of the sensitivitytest as functions of grating parameters; and

FIG. 7 illustrates the effect of an overlay error on a scatterometrysignal (diffraction efficiency) as measured on the optimal structure.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1, there is schematically illustrated a cross-sectionof a test site 10 in a semiconductor wafer suitable for use in thepresent invention. The site 10 contains two gratings (patternedstructures) 12 and 14 of certain known periodicity located one above theother. In the present example, the gratings 12 and 14 have substantiallythe same period P. In the present example, the top grating 12 presents apattern of spaced-apart photoresist-containing regions R_(PR), and theunderneath grating 14 presents a pattern of spaced-apartaluminum-containing region R_(Al). In this specific example, thegratings 12 and 14 have different duty cycles defined by featurescritical dimensions CD_(PR) and DC_(Al), respectively. It should,however, be noted that this condition is not a requirement for thetechnique of the present invention, but provides for a bettersensitivity of the method. As further shown in the figure, the gratings12 and 14 are shifted along the X-axis with respect to each other adistance S, which is measured as a distance between the centers of thetwo locally adjacent regions (lines) R_(PR) and R_(Al).

In order to find the conditions under which the method of the presentinvention is most effective, and show how the method is practical, thesensitivity of the method has been studied for a specific configurationof the site structure exemplified in FIG. 1. The site structure 10 istypical for the overlay problem in photoresist-on-aluminum layerstructure. The pattern in the aluminum (Al) layer is typically definedby layers underneath the aluminum layer, and the photoresist (PR) layeris patterned by a lithography processing. In this specific example, thePR lines are modeled to be on top of the Al lines. It should, however,be understood, that this is not essential for the present invention, andPR lines may be located between the Al lines, as well. For simplicity,both gratings 12 and 14 have a square profile. The measurement techniqueused for this analysis is the normal incidence polarizedspectrophotometry. According to this technique, the normal incidencereflectivity spectrum is measured with selective polarization directionof the incident light relative to the grating (TM polarization mode inthis specific example). Other optical techniques, such as spectralellipsometry, angular scatterometry, etc. may be used as well.

The sensitivity of the spectrum (measured by the technique of thepresent invention, which will be described more specifically furtherbelow) to a change in the lateral shift S between the gratings 12 and 14has been studied. The ratio between the mean change in the spectrum(defined as the root of the mean of the square differences betweenspectra with and without a change in the shift) caused by a change inthe shift value S of 1 nm has been defined as the sensitivity test T,wherein S is the nominal shift.

The simulation results have shown that T depends on all the parametersof the test structure. Values of T are almost always monotonouslyincreasing with the values of S. This general rule holds as much as Tcan be increased, i.e., until the edge of the PR line “falling off” fromthe Al line. It is thus evident that the measurement is more sensitivefor an asymmetrical structure.

As for the other parameters of the test site, such as the period P, theCD_(PR) and CD_(Al) (generally, the duty cycles of gratings) and theheights H_(PH) and H_(Al) of the two gratings, they usually affect thesensitivity test T in an oscillatory manner. It is thus necessary tofind such a set of gratings parameters, that T is maximized while beingleast sensitive to the exact values of these parameters. For example,the value of T equal to 8.10⁻³ is obtained with the following set ofgratings' parameters: P=600 nm, CD_(PR)=300 nm, CD_(AL)=150 nm,H_(PR)=600 nm, and H_(AL)=100 nm.

In one embodiment of the invention, the direct method is used. In thismethod exact simulation methods, such as RCWT (Rigorous Couple WaveTheory), are used to simulate the diffraction signature(s) from the testsite. In the simplest case there is not any prior knowledge of the exactgrating properties on either layers. In this case the experimentallymeasured diffraction from the test site is fitted to simulation fittingat the same time for both CD's, grating heights and additionalparameters characterizing the individual gratings in the two layers andthe shift as an additional fitting parameter.

FIGS. 2 and 2B exemplify the principles underlying the design of a testsite 20 suitable to be used for another embodiment of the presentinvention. The test site 20 is formed by regions 24 and 26 located oneon top of the other in layers L₁ and L₂, respectively. As shown in FIG.2B, the two regions 24 and 26 define together four different pairs ofsub-regions: A₁-A₂, B₁-B₂, C₁-C₂ and D₁-D₂, wherein sub-regions A₂, B₂,C₂ and D₂ are located on top of sub-regions A₁, B₁, C₁ and D₁,respectively. In the pair A₁-A₂, sub-regions A₁ and A₂ are different inthat region A₁ contains a grating G_(A1) and sub-region A₂ has nograting at all, and in the pair D₁-D₂—vice versa. Gratings G_(B1) andG_(B2) of sub-regions B₁ and B₂, respectively, are shifted with respectto each other along the X-axis a distance +Δx (i.e., in the positiveX-direction), and gratings G_(C1) and G_(C2) are shifted with respect toeach other a distance −Δx (negative X-direction). In this embodimentinformation is gained from measuring the single-grating sites (subregions A₁-A₂ and D₁-D₂) in order to simplify the fitting in thedual-grating sites (sub regions B₁B₂ and C₁-C₂). The measurement is donein two steps. In the first step the single-grating sites are measuredand the grating characteristics in those sites, including for exampleCD, height wall angle etc., are measured by fitting to simulation, as innormal scatterometry. In the second step the measurements of thedual-grating sites are fitted to simulation using all or part of thegrating parameters that have been measured in Step 1 and fitting for theshift between the gratings. It should be noted that at least thosegratings which are located in a common layer must be are identical,i.e., have the same period, duty cycle, and height.

Notice that for the case of perfect alignment the measurements of sitesB and C should be identical, thus a significant difference between thetwo measurement may indicate an alignment error. The difference betweenthe two signals obtained from sub-region pairs B₁-B₂ and C₁-C₂,respectively, may be utilized in order to increase the sensitivity andreduce systematic measurement errors. This can be done by fitting thedifference of simulated signatures to the difference of the measurementsin the two sites. This procedure may be used in order to filter outchanges in the spectrum that are not related to the shift S, thusenhancing the sensitivity and the robustness of the measuring technique.

In another embodiment of the invention, the reference site method isused. FIG. 3 illustrates the main principles underlying this method.Here, a test site 30, which is formed by two regions one above the otherin layers L₁ and L₂, is composed of a so-called “measurement site” 32and a so-called “reference site” 34 spaced-apart from each other alongthe X-axis. Gratings in these sites are not specifically illustrated,but is should be understood that both the measurement and the referencesites include sub-region pairs arranged as described above. In thismethod, the measurement site 32 has one grating-pair characterized by anominal shift (+ΔX) between the gratings, and the reference site 34 hasseveral grating-pairs located in sub-region pairs, respectively, alignedin a spaced-apart relationship along the X-axis and characterized by thefollowing nominal shifts: −ΔX−3Δx, −ΔX−2Δx, −ΔX−Δx, −ΔX, −ΔX+Δx,−ΔX+2Δx, −ΔX+3Δx, . . . etc., Δx is typically much smaller than ΔX andis of the same order of magnitude as the required resolution in thelateral shift measurement. In this method, it is assumed that thegrating profiles are sufficiently symmetric and unaffected by the exactshift, and therefore symmetric shifts between the gratings (uppergrating shifted to either right or left of the lower grating) willresult in the identical diffraction signatures.

When the two layers are printed with an alignment error (+ξ), the actualshifts between the gratings of the measurement site will be: (+ΔX+ξ) andfor the reference sites the shifts will be as follows (−ΔX−3Δx+ξ);(−ΔX−2Δx+ξ); (−ΔX−Δx+ξ); (−ΔX+ξ); (−ΔX+Δx+ξ); (−ΔX+2Δx+ξ); etc.

In order to measure the alignment error ξ, the diffraction signaturesfrom all the sub-region pairs are measured using one of the abovementioned measurement techniques. Then, the signature from themeasurement site is compared to the signatures from all the sub-regionpairs in the reference site, looking for the best match. If the bestmatch is found for the (+N)′^(th) sub-region pair, for which the nominalshift is (−ΔX+NΔx), than we have:(+ΔXr+ξ)≈−(−ΔXr+NΔx+ξ)and therefore:ξ≈(−NΔx)/2

Hence, the shift with the resolution of Δx/2 can be found by simplyfinding the best matching signature from the set.

If a significant range of shifts is to be covered by a small number ofsub-region pairs in the reference site, Δx should be selected to besignificantly larger than the required resolution. In this case, someinterpolation method can be used in order to find the shift withimproved accuracy. Interpolation can be done, for example, bycalculating the RMS (root mean square) of the difference between themeasurement site signature and all reference site signatures, fittingall or part of the results to a polynomial function of the shift andfinding the shift providing minimum RMS difference in signatures.Another optional interpolation method is using a learning system, whichis trained using the reference site data to return the shift, andmeasurement site data is used as input for interpretation. Comparing thereference site method to the direct method, the reference site method isadvantageously self-calibrating, i.e., there is no need to realize thepotentially complex details about how the diffraction signature wascreated, including materials properties and exact geometry (e.g. CD,line profile), as long as these are constant for all involved sites. Thereference site method, however, requires a larger area on the sampleoccupied by a test site and a larger number of measurements, requiringmore time.

In yet another embodiment of the invention, a calibration method may beused. In this method, a test site similar to the test site 20 of FIGS.2A and 2B (suitable to be used for direct method) but including only twograting-containing sub-region pairs B₁-B₂ and C₁-C₂ is used. Here,similarly to the direct method, the difference between the diffractionsignatures measured on both sub-region pairs is determined, but, indistinction to the direct method, the resulting signature is not fittedto a theoretical signature, but is rather interpreted using a previouslyperformed calibration stage. In the calibration stage, the signature (oronly some sensitive points thereof) is determined as a function ofalignment error values, being measured by a suitable reference tool(e.g., ordinary microscope). To this end, a test sample (e.g.,semiconductor wafer) is specifically prepared with several alignmentshifts, and measured off-line to make a record of the calibrationresults and keep it as reference data.

In accordance with still another embodiment of the test structure maycontain a two-dimensional grating enabling the measurement of the X andthe Y components of the lateral shift at the same site. In that case, inorder to avoid the possibility to confuse between the X and the Ycomponents further several methods may be used. In accordance with oneembodiment, test site is prepared, comprising two dimension grating witha period in the Y-axis significantly different than the period in theX-axis. In accordance with another embodiment polarized reflectometrytechnique may be used to measure the same site several times withdifferent polarizations. Finally, the same site may be measured fromdifferent directions (with different orientation). All the above methodsresult in different changes to the diffraction signatures due to shiftsin different directions, thus avoiding confusion.

Reference is now made to FIGS. 4-6 showing different simulation resultsof the sensitivity test as functions of grating parameters. FIG. 4illustrates the sensitivity test as a function of Al grating depth(H_(Al)) and shift S using the test structure of FIG. 1 with thefollowing parameters: CD_(PR)=150 nm, CD_(Al)=300 nm, P=800 nm andH_(PR)=600 nm. FIG. 5 illustrates the sensitivity test as a function ofAl grating depth (H_(Al)) and grating period P using the test structureof the following parameters: CD_(PR)=150 nm, CD_(Al)=300 nm, H_(PR)=600nm and S=75 nm. FIG. 6 illustrates the sensitivity test as a function ofAl grating depth using the test structure of the following parameters:CD_(PR)=150 nm, CD_(Al)=300 nm, P=600 nm and H_(PR)=600 nm. Two graphsR1 and R2 are shown corresponding, respectively, to TM and TEpolarization modes of incident radiation relative to the gratingorientation.

FIG. 7 illustrates the effect of a 5 nm overlay error on a scatterometrysignal (diffraction efficiency) measured on the optimal structure withthe TM polarization mode. Two diffraction signatures SG₁ and SG₂ areshown corresponding, respectively, to a sample with no lateral shiftbetween the layers (i.e., overlay is zero) and to a sample with a 5 nmoverlay error.

Obviously, many modifications and variations of the present inventionare possible in the light of the above teachings. For example, in thereference site based method grating-pairs located in sub-region pairsmay be characterized by pre-determined arbitrary nominal shifts.

Those skilled in the art will readily appreciate that many modificationsand changes may be applied to the invention as hereinbefore exemplifiedwithout departing from its scope, as defined in and by the appendedclaims.

1. A method for controlling alignment of two patterned structures in asample, the method comprising: performing a process of opticalmeasurement on at least one measurement site in the sample, the at leastone measurement site including said two pattern structures each formedby spaced-apart features, such that the spaced-apart features of onepatterned structure are arranged between the spaced-apart features ofthe other patterned structure, said process of optical measurementcomprising normal incidence polarized spectrophotometry performed byilluminating the at least one measurement site, detecting diffractionproperties of the measurement site, and generating measured dataindicative thereof; analyzing said measured data and outputting datarepresentative of an existing lateral shift between the two patternstructures.
 2. The method of claim 1, comprising measuring the normalincidence reflectivity spectrum of the measurement site with at leasttwo different polarization states defined by different polarizationdirections of the incident light relative to orientation of thepatterned structures.
 3. The method of claim 2, wherein the polarizationstates include TM and TE polarization modes of the incident lightrelative to the patterned structure orientation.
 4. The method of claim1, wherein the optical measurement includes at least one of spectralellipsometry and angular scatterometry.
 5. The method of claim 1,wherein the process of optical measurement is applied to at least oneadditional site including two patterned structures each formed byspaced-apart features such that the spaced-apart features of onepatterned structure are arranged between the spaced-apart features ofthe other patterned structure.
 6. The method of claim 1 wherein thepatterns of the patterned structures are two-dimensional.
 7. The methodof claim 6 wherein periods of the two-dimensional pattern are differentalong the two dimensions.
 8. The method of claim 1 wherein said sampleis a semiconductor wafer.
 9. The method of claim 1, wherein the twopatterned structures are of the same periodicity.
 10. The method ofclaim 1, wherein each of the two patterned structures has a squareprofile.
 11. The method according to claim 1, wherein at least one ofthe two patterned structures has a pattern of spaced-apart photoresistregions.
 12. A method for controlling alignment of two patternedstructures in a sample, the method comprising: performing a process ofoptical measurement on at least one measurement site in the sample, theat least one measurement site including said two pattern structures eachformed by spaced-apart features, such that the spaced-apart features ofone patterned structure are arranged between the spaced-apart featuresof the other patterned structure, said process of optical measurementcomprising illuminating the at least one measurement site, detectingdiffraction properties of the measurement site by measuring adiffraction efficiency of radiation diffracted from the patternedstructures as a function of wavelength, and generating measured dataindicative thereof; analyzing said measured data and outputting datarepresentative of an existing lateral shift between the two patternstructures.
 13. The method of claim 12, wherein the optical measurementincludes normal incidence polarized spectrophotometry.
 14. The method ofclaim 12 wherein the patterns of the patterned structures aretwo-dimensional.
 15. The method of claim 14, wherein periods of thetwo-dimensional pattern are different along the two dimensions.
 16. Themethod of claim 12, wherein said sample is a semiconductor wafer. 17.The method of claim 12, wherein the two patterned structures are of thesame periodicity.
 18. The method of claim 12, wherein each of the twopatterned structures has a square profile.
 19. The method according toclaim 12, wherein at least one of the two patterned structures has apattern of spaced-apart photoresist regions.
 20. A method forcontrolling alignment of two patterned structures in a sample, themethod comprising: performing a process of optical measurement on atleast one measurement site in the sample, the at least one measurementsite including said two pattern structures each formed by spaced-apartfeatures, such that the spaced-apart features of one patterned structureare arranged between the spaced-apart features of the other patternedstructure, said process of optical measurement comprising illuminatingthe at least one measurement site, detecting diffraction properties ofthe measurement site by measuring a diffraction efficiency of radiationdiffracted from the patterned structures as a function of angle ofincidence, and generating measured data indicative thereof; analyzingsaid measured data and outputting data representative of an existinglateral shift between the two pattern structures.
 21. The method ofclaim 20, wherein the patterns of the patterned structures aretwo-dimensional.
 22. The method of claim 21, wherein periods of thetwo-dimensional pattern are different along the two dimensions.
 23. Themethod of claim 20, wherein said sample is a semiconductor wafer. 24.The method of claim 20, wherein the two patterned structures are of thesame periodicity.
 25. The method of claim 20, wherein each of the twopatterned structures has a square profile.
 26. The method according toclaim 20, wherein at least one of the two patterned structures has apattern of spaced-apart photoresist regions.
 27. A method forcontrolling alignment of two patterned structures in a sample, themethod comprising: performing a process of optical measurement on atleast one measurement site in the sample, the at least one measurementsite including said two pattern structures each formed by spaced-apartfeatures, such that the spaced-apart features of one patterned structureare arranged between the spaced-apart features of the other patternedstructure, said process of optical measurement comprising illuminatingthe at least one measurement site, detecting diffraction properties ofthe measurement site by measuring a diffraction efficiency of radiationdiffracted from the patterned structures as a function of angle ofdiffraction, and generating measured data indicative thereof; analyzingsaid measured data and outputting data representative of an existinglateral shift between the two pattern structures.
 28. The method ofclaim 27, wherein the patterns of the patterned structures aretwo-dimensional.
 29. The method of claim 28, wherein periods of thetwo-dimensional pattern are different along the two dimensions.
 30. Themethod of claim 27, wherein said sample is a semiconductor wafer. 31.The method of claim 27, wherein the two patterned structures are of thesame periodicity.
 32. The method of claim 27, wherein each of the twopatterned structures has a square profile.
 33. The method according toclaim 27, wherein at least one of the two patterned structures has apattern of spaced-apart photoresist regions.
 34. A method forcontrolling alignment of two patterned structures in a sample, themethod comprising: performing process of optical measurement on at leastone measurement site in the sample, the at least one measurement siteincluding said two pattern structures each formed by spaced-apartfeatures, such that the spaced-apart features of one patterned structureare arranged between the spaced-apart features of the other patternedstructure, said process of optical measurement comprising illuminatingthe at least one measurement site, detecting diffraction properties ofthe measurement site by measuring a diffraction efficiency of radiationdiffracted from the patterned structures as a function of angle ofincidence and angle of diffraction, and generating measured dateindicative thereof; analyzing said measured data and outputting datarepresentative of an existing lateral shift between the two patternstructures.
 35. A method for controlling alignment of two patternedstructures in a sample, the method comprising: performing a process ofoptical measurement on at least one measurement site in the sample, theat least one measurement site including said two pattern structures eachformed by spaced-apart features, such that the spaced-apart features ofone patterned structure are arranged between the spaced-apart featuresof the other patterned structure, said process of optical measurementcomprising illuminating the at least one measurement site, detectingdiffraction properties of the measurement site by measuring adiffraction efficiency of radiation diffracted from the patternedstructures as a function of change of amplitude and phase of thediffracted light, and generating measured data indicative thereof;analyzing said measured data and outputting data representative of anexisting lateral shift between the two pattern structures.
 36. Themethod of claim 35, wherein the patterns of the patterned structures aretwo-dimensional.
 37. The method of claim 36 wherein periods of thetwo-dimensional pattern are different along the two dimensions.
 38. Themethod of claim 35, wherein said sample is a semiconductor wafer. 39.The method of claim 35, wherein the two patterned structures are of thesame periodicity.
 40. The method of claim 35, wherein each of the twopatterned structures has a square profile.
 41. The method according toclaim 35, wherein at least one of the two patterned structures has apattern of spaced-apart photoresist regions.
 42. A method forcontrolling alignment of two patterned structures in a sample, themethod comprising: performing a process of optical measurement on atleast one measurement site in the sample, the at least one measurementsite including said two pattern structures each formed by spaced-apartfeatures, such that the spaced-apart features of one patterned structureare arranged between the spaced-apart features of the other patternedstructure said process of optical measurement comprising illuminatingthe at last one measurement site with incident light with more than twodifferent states of polarization, detecting diffraction properties ofthe measurement site, and generating measured data indicative thereof;analyzing said measured data and outputting data representative of anexisting lateral shift between the two pattern structures.
 43. Themethod of claim 42, wherein the patterns of the patterned structures aretwo-dimensional.
 44. The method of claim 43, wherein periods of thetwo-dimensional pattern are different along the two dimensions.
 45. Themethod of claim 42, wherein said sample is a semiconductor wafer. 46.The method of claim 42, wherein the two patterned structures are of thesame periodicity.
 47. The method of claim 42, wherein each of the twopatterned structures has a square profile.
 48. The method according toclaim 42, wherein at least one of the two patterned structures has apattern of spaced-apart photoresist regions.